What’s inside HoloLens

Virtual reality is catching up, Microsoft revealed what is the computing power inside the HoloLens(very high computing power inside that device!).

” The secretive HPU is a custom-designed TSMC-fabricated 28nm coprocessor that has 24 TensilicaDSP cores arranged in 12 clusters. It has about 65 million logic gates, 8MB of SRAM, and a layer of 1GB of low-power DDR3 RAM on top, all in a 12mm-by-12mm BGA package. We understand it can perform a trillion calculations a second. “

“The unit sits alongside a 14nm Intel Atom x86 Cherry Trail system-on-chip, which has its own 1GB of RAM and runs Windows 10 and apps that take advantage of the immersive noggin-fitted display.”

More here.

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